L200C濃縮切削液L200C濃縮切削液

　　L200C Cutting Fluid Conc. for Silicon Ingot Bricking/Squaring / Cropping

　　用于硅錠切塊/破方/修整的L200C濃縮切削液

　　Application: Diamond wire & Band saw processes

　　用途:金剛石線鋸和帶鋸流程

　　L200C lubricant Series is a biodegradable water based, non caustic material

　　L200C系列潤滑劑是一種可生物降解、水性、非堿性物質(zhì)

　　Dilution ratio of DI /RO water: Cutting Fluid - 50:1 to 80:1

　　去離子水/反滲透水溶液比例:切削液 - 50:1至80:1

　　Excellent wetting and rinsing properties

　　極好的濕潤和沖洗功能

　　Increases heat transfer (heat dissipation) hence reduces heat buildup and thermal stress

　　可以加快傳熱(散熱)速度，減少生熱和熱應(yīng)力

　　High speed water surface tension reducer

　　迅速降低水表面張力

　　Prevents silicon dust (swarf) agglomeration, allowing for easier cutting

　　防止硅塵(硅屑)堆積，更加容易切削